KingdomTaurusNews.com – MediaTek has launched the Dimensity 1050 system-on-chip (SoC) for use in the next generation of 5G smartphones.
MediaTek Dimensity 1050
Through dual connectivity using mmWave and sub-6GHz,
The Mediatek Dimensity 1050 chipset combines mmWave 5G and sub-6GHz to seamlessly migrate between network bands, a highly efficient 6nm TSMC production process with an octa-core CPU.
“Dimensity 1050, and the combination of sub-6GHz and mmWave technologies, will deliver an end-to-end 5G experience, seamless connectivity,” said CH Chen, Deputy General Manager, Wireless Communications Business.
Supporting 3CC carrier aggregation on sub-6 spectrum (FR1) and 4CC carrier aggregation on mmWave spectrum (FR2), Dimensity 1050 will be able to provide up to 53 percent faster speeds and wider coverage to smartphones compared to LTE+ mmWave aggregation alone.
The SoC integrates two premium Arm Cortex-A78 CPUs clocking up to 2.5GHz and the latest Arm Mali-G610 graphics engine.
The Dimensity 1050 offers Wi-Fi optimization with MediaTek’s HyperEngine 5.0 gaming technology to ensure lower latency connections with the new tri-band 2.4GHz, 5GHz, and 6GHz that extend gaming time and performance, and supports UFS 3.1 storage and LPDDR5 memory.
MediaTek also announced the chipsets, Dimensity 930 5G and Helio G99. The Dimensity 930 will be available during the second quarter of 2022, while the Dimensity 1050 and Helio G99 will be available in the third quarter of 2022.